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| Specification of PCB Manufacturing | |
|---|---|
| Layer | 1~32 Layers |
| Material | FR4, CEM1, CEM3, High TG, Rogers, F4B, Taconic, FR1, FR2, 94v0, Aluminum |
| Order Quantity | 1~500,000 |
| Board shape | Rectangular, Round, Slots, Cutouts, Complex, Irregular |
| Board Cutting | Shear, V-score, Tab-routed, Countersunk |
| Board thickness | 0.2~8.0mm, Flex 0.01~0.25" |
| Copper weight | 0.5oz~12oz |
| Solder mask | Double-sided green LPI, Also support red, white, yellow, blue, black, purple, etc |
| Silk screen | Double-sided or single-sided in white, yellow, red, black, or negative |
| Min line width/space | 0.06/0.06mm |
| Max board dimensions | 25.6 inch * 43.3 inch or 650mm * 1100mm |
| Min drill hole diameter | 0.1mm |
| Surface finish | HASL, ENIG, Immersion Tin, Immersion Silver, OSP, ENEPIG, etc |
| Board thickness tolerance | ±10% |
| Minimal slot width | 0.12", 3.0mm, or 120 mils |
| V-score depth | 20~25% of board thickness |
| PTH Wall Thickness | >0.025mm |
| PTH Hole Dia Tolerance | ±0.076mm |
| Non PTH Hole Dia Tolerance | ±0.05mm |
| Hole Position Deviation | ±0.076mm |
| Sink holes | Yes |
| Quality Standard | IPC-A600F/MIL-STD-1050D |
| Design file format | Ki-CAD, Pro-E, Gerber RS-274X, 274D, Eagle, AutoCAD's DXF, DWG |
| Specification of PCB Assembly Manufacturing | |
|---|---|
| Assembly Options | Surface Mount (SMT), Thru-Hole (THT), Box building, COB, Conformal Coating, Potting and Encapsulations, IC Programming, Marking Grinding & Lettering |
| Types of Solder | Leaded and Lead-free (RoHS Compliant) PCB assembly services |
| Stencils | Laser cut stainless steel stencils |
| Minimum Order | 1 pieces |
| Component Size | Passive Component: accept components as small as 01005, 0201. BGA: handle BGA of 0.25mm pitch with X-ray testing. Fine Pitch Parts: assemble 0.25mm fine pitch parts, POP (Package on Package), QFP, CCGA, CSP, etc. Max Component Height: 25mm (SMT), Top 120mm / Bot 15mm (Wave-Solder) |
| Component Package | Reels, Cut Tape, Tube & Tray, Loose Parts and Bulk |
| Board Dimension | Min Board Size: No Limited. Max Board Size: 680x500mm |
| Board Shape | Rectangular, Circular and any Odd Shapes |
| Board Type | Rigid PCB, Flexible PCB, Rigid-flex PCB, Metal PCB |
| Repair & Rework | Repair and rework accepted. BGA reballing service to safely remove misplaced BGA, reball it and place back on the PCB correctly. Cost-effective. |
| Testing | ICT, AOI, X-Ray, Function Test (FCT), Aging Test |
| Output | 12 SMT lines and 5 DIP lines |
| Quality Standard | IPC-A-610E, ISO 13485:2003, ISO 16949:2011, ISO 14001:2004 |
| ITEM | TECHNICAL PARAMETER |
|---|---|
| Base material | FR4, Medium TG, High TG, F4B, PTFE, R4350 |
| Layers | 1-24 LAYERS |
| Max. Board Size | 610mm × 880mm (Single/double sided panels, Multilayer board) |
| Board Thickness | 0.20-3.2mm |
| Cu Thickness | 1OZ — 6OZ |
| Min. Line Width | 2.5mil |
| Min Space | 2.5mil |
| Min Hole Size | 0.15mm |
| PTH Wall Thickness | >0.020mm |
| PTH Hole Dia Tolerance | ±0.076mm |
| Non PTH Hole Dia Tolerance | ±0.05mm |
| Hole Position Deviation | ±0.076mm |
| Outline Tolerance | ±0.05mm |
| V-cut | 30°/45°/60° |
| Insulation Resistance | 10^12 Normal |
| Peel-off Strength | 1.4N/mm |
| Soldermask Dia Tolerance | ±10% |
| Solderability Test | 280℃ (5-8s) |
| Flammability | 94v0 |
| E-test Voltage | 50-250v |
| Bow/Twist | ≤1% |
| Quality Standard | IPC-A600F/MIL-STD-105D |
| PCB Lead Time | |||
|---|---|---|---|
| Layer | Prototype Quick Turn | Prototype Usual Time | Mass Productions (Above 30 m²) |
| 2 Layers | 12 hours | 3-4 days | 8-10 days |
| 4 Layers | 24 hours | 5-6 days | 10-12 days |
| 6 Layers | 48 hours | 6-8 days | 12-14 days |
| 8 Layers | 72 hours | 8-10 days | 14-16 days |
| More Layers | ..... | ..... | ..... |
| PCB Assembly Lead Time | ||
|---|---|---|
| Order Conditions | The Fastest Delivery Date | Standard Delivery Date |
| Prototype (<20 pcs) | 8 hours | 2 days |
| Small Volume (20-100 pcs) | 12 hours | 3 days |
| Medium Volume (100-1000 pcs) | 24 hours | 6 days |
| Mass Productions (>1000 pcs) | Depends on BOM | Depends on BOM |